Subsurface damage distribution and processing method of ground fused silica-Reference-Cited by-同舟云学术

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Subsurface damage distribution and processing method of ground fused silica

Published:2017-10-24 Issue: Volume: Page:
ISSN:
Container-title:AOPC 2017: Laser Components, Systems, and Applications
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Author:

Cai Chao,Hu Qing,Zhao Heng,Gang Wang,xiang He,Ping Ma

Publisher

SPIE

Reference22 articles.

1. Role of Cracks, Pores, and Absorbing Inclusions on Laser Induced Damage Threshold at Surfaces of Transparent Dielectrics

2. Damage Resistant Optical Glasses for High Power Lasers: A Continuing Glass Science and Technology Challenge;Campbell;Glass Science and Technology,2002

3. Comparative Study on Surfaces of Single-Crystalline Substrates. From Dielectric Substance to Semiconductor and Metal. Machining and Processing Technologies and Quality of Silicon Wafer Surfaces.

4. Subsurface Damage in Optical Materials: Origin Measurement & Removal;Hed;Optical Fabrication and Testing Workshop,1988

5. Mechanism of the Diamond Lapping Process

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1. Hemispherical resonator with low subsurface damage machined by small ball-end fine diamond grinding wheel: A novel grinding technique;Chinese Journal of Aeronautics;2023-08

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