-Reference-Cited by-同舟云学术

Laser processes for multichip module's high-density multilevel thin film packaging

Author:

Patel Rajesh S.,Wassick Thomas A.

Publisher

SPIE

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Performance Study of 266nm UV Nanosecond Laser Micromachined Glow Discharge Polymer Films;2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO);2023-07-31

2. Laser ablation of polymers: a review;Polymer International;2019-05-18

3. Laser Ablation of Polymers: A Review;Procedia Manufacturing;2019

4. Laser ablation of block copolymers with hydrogen-bonded azobenzene derivatives;Frontiers of Chemical Science and Engineering;2018-09

5. Modeling of nanosecond pulsed laser processing of polymers in air and water;Modelling and Simulation in Materials Science and Engineering;2018-05-15

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