Novel methodology to optimize wafer alignment to enhance 14nm on product overlay-Reference-Cited by-同舟云学术

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Novel methodology to optimize wafer alignment to enhance 14nm on product overlay

Published:2017-03-17 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Samudrala Pavan¹,Chung Woong Jae¹,Subramany Lokesh¹,Gao Haiyong¹,Aung Nyan¹,Oh Seung Chul²,Lee Shawn²,Delvigne Erik²,Minghetti Blandine²

Affiliation:

1. GLOBALFOUNDRIES Inc. (United States)

2. ASML (United States)

Publisher

SPIE

Reference3 articles.

1. A study of overlay mark robustness and enhanced alignment techniques for alignment improvement on metal layers of sub-100nm technology;Dubey,2007

2. High Order Wafer Alignment in Manufacturing;Pike,2012

3. Improving Scanner Wafer Alignment Performance by Target Optimization;Leray,2016

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