An 80x80 microbolometer type thermal imaging sensor using the LWIR-band CMOS infrared (CIR) technology-Reference-Cited by-同舟云学术

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An 80x80 microbolometer type thermal imaging sensor using the LWIR-band CMOS infrared (CIR) technology

Published:2017-02-22 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Infrared Technology and Applications XLIII
language:
Short-container-title:

Author:

Tankut Firat¹,Cologlu Mustafa H.¹,Askar Hidir¹,Ozturk Hande¹,Dumanli Hilal K.¹,Oruc Feyza¹,Tilkioglu Bilge¹,Ugur Beril¹,Akar Orhan Sevket¹,Tepegoz Murat¹,Akin Tayfun¹

Affiliation:

1. MikroSens Elektronik San ve Tic A.S. (Turkey)

Publisher

SPIE

Reference16 articles.

1. MEMS-based uncooled infrared bolometer arrays: a review

2. Recent progress in infrared detector technologies

3. Easy to use uncooled ¼ VGA 17 µm FPA development for high performance compact and low-power systems;Robert,2012

4. MEMS-Based Uncooled Infrared Focal Plane Arrays;Kimata,2007

5. Two-million-pixel SOI diode uncooled IRFPA with 15µm pixel pitch;Fujisawa,2012

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Practical Validation of Uncooled Thermal Imagers for Small RPAS;Drones;2021-11-06

2. A visible-infrared double band photodetector absorber;Results in Physics;2020-09

3. Low-Cost Microbolometer Type Infrared Detectors;Micromachines;2020-08-24

4. Development of new pixel structure for beyond 12-µm pixel pitch SOI diode uncooled IRFPAs;Infrared Technology and Applications XLVI;2020-04-23

5. A 160x120 LWIR-band CMOS Infrared (CIR) microbolometer;Infrared Technology and Applications XLV;2019-05-15

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