-Reference-Cited by-同舟云学术

Microassembly technologies for MEMS

Author:

Cohn Michael B.,Boehringer Karl F.,Noworolski J. Mark,Singh Angad,Keller Chris G.,Goldberg Kenneth A.,Howe Roger T.

Publisher

SPIE

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Size Changing Soft Modules for Temperature Regulated Self-assembly and Self-disassembly;2022 IEEE 5th International Conference on Soft Robotics (RoboSoft);2022-04-04

2. Effects of cutout and thermal environment on vibration of FG cylindrical micropanels based on the three-dimensional MCST;Journal of the Brazilian Society of Mechanical Sciences and Engineering;2021-04-03

3. Acousto-fluidic system assisting in-liquid self-assembly of microcomponents;Journal of Micromechanics and Microengineering;2013-11-14

4. A Mechanism Approach for Enhancing the Dynamic Range and Linearity of MEMS Optical Force Sensing;Signal Measurement and Estimation Techniques for Micro and Nanotechnology;2011

5. Interfacial-Energy-Controlled Deposition Technique of Microstructures Using Blade-Coating;The Journal of Physical Chemistry B;2009-10-27

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