HVM metrology challenges towards the 5nm node

Author:

Bunday Benjamin1

Affiliation:

1. SUNY Poly SEMATECH (United States)

Publisher

SPIE

Reference114 articles.

1. The International Technology Roadmap for Semiconductors (San Jose: Semiconductor Industry Association, 2014); available from the Internet: http://member.itrs.net.

2. Gaps Analysis for CD Metrology Beyond the 22 nm Node;B.,2013

3. CD-SEM metrology for sub-10 nm width features;Bunday,2014

4. Scanning electron microscopy imaging of ultra-high aspect ratio hole features;Cepler,2012

5. Novel metrology methods for fast 3D characterization of directed selfassembly (DSA) patterns for high volume manufacturing;Sarma,2014

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