Author:
Bian Shengwei,Yang Xue,Feng Jiang,Liu Lei,Wang Chao,Liu Yang
Cited by
1 articles.
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1. Simulation of thermal stress on soldering surface of conduction cooling end-pumped slat laser amplifier;AOPC 2023: Laser Technology and Applications; and Optoelectronic Devices and Integration;2023-12-18