Advances in bonding technology for high power diode laser bars-Reference-Cited by-同舟云学术

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Advances in bonding technology for high power diode laser bars

Published:2015-02-20 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Wang Jingwei,Li Xiaoning,Hou Dong,Feng Feifei,Liu Yalong,Liu Xingsheng

Publisher

SPIE

Reference31 articles.

1. High-brightness high-power fiber coupled diode laser system for material processing and laser pumping;Faircloth,2003

2. DPSSL and FL Pumps Based on 980nm-Telecom Pump Laser Technology: Changing the Industry;Lichtenstein,2004

3. 3000W CW diode laser cladding system

4. Recent Development in Diode Laser Technology for Hair Removal Application;Liu,2014

5. Technology Trend and Challenges in High Power Semiconductor Laser Packaging;Liu,2009

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal hydraulic performance of a microchannel heat sink for cooling a high-power diode laser bar;Applied Optics;2019-03-06

2. An Adaptive Use Strategy for Solid-State Lasers by Combining Maximum Likelihood Estimation With Model Predictive Control;IEEE Access;2019

3. Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics;Components and Packaging for Laser Systems IV;2018-02-20

4. Packaging of hard solder 500W QCW diode laser array;Components and Packaging for Laser Systems II;2016-04-22

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