Well-fixed acetabular component retention or replacement: The whys and the wherefores
Author:
Publisher
Elsevier BV
Subject
Orthopedics and Sports Medicine
Reference6 articles.
1. Patterns of osteolysis around total hip components inserted with and without cement;Zicat;J Bone Joint Surg Am,1995
2. Inhibition of wear debris mediated osteolysis in a canine total hip arthroplasty model;Shanbhag;Clin Orthop,1997
3. A new classification system for the management of acetabular osteolysis after total hip arthroplasty;Rubash;Instr Course Lect,1999
4. The revision acetabulum: Dealing with bone loss. Socket retention: Staying in place;Maloney;Orthopedics,2000
5. The fate of pelvic osteolysis after reoperation: No recurrence with lesional treatment;Schmalzried;Clin Orthop,1998
Cited by 35 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Is Retention of the Acetabular Component at Revision Surgery a Long-Term Solution?;Arthroplasty Today;2023-10
2. Long-Term Outcomes of Cementing Highly Cross-Linked Polyethylene Liners Into Well-Fixed Acetabular Shells in Revision Total Hip Arthroplasty;The Journal of Arthroplasty;2023-07
3. Does Revision of an Acetabular Shell With Insertion of an Uncemented Constrained Liner Confer Benefit Over Cementing Into a Well-Ingrown Shell?;The Journal of Arthroplasty;2022-08
4. Cementation of the highly cross‐linked polyethylene liner into a well‐fixed acetabular shell to treat patients with recurrent dislocation after total hip arthroplasty;Artificial Organs;2020-12-16
5. Fate of the Retained Acetabular Component During Revision Total Hip Arthroplasty: A Meta-Analysis and Systematic Review;The Journal of Arthroplasty;2020-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3