Enhanced Cu‐Teflon adhesion by presputtering prior to the Cu deposition
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.98637
Reference22 articles.
1. Interfacial reaction during metallization of cured polyimide: An XPS study
2. An XPS and TEM Study of Intrinsic Adhesion Between Polyimide and Cr Films
3. Metal polyimide interface: A titanium reaction mechanism
4. Photoemission spectroscopy study of aluminum–polyimide interface
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