Double-hump diffusion profiles of copper and nickel in germanium wafers yielding vacancy-related information
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.127071
Reference15 articles.
1. Diffusion and solubility of copper in germanium
2. Diffusion and solubility of copper, silver, and gold in germanium
3. Diffusion of Nickel and Zinc in Germanium
4. A novel device for short-time diffusion annealing
5. Triple Acceptors in Germanium
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