Author:
Shaji Athul,Sankaran Krishnaswamy
Reference48 articles.
1. G. Ellison, Thermal computations of electronics, conductive, radiative and convective air cooling. CRC Press, Taylor and Francis Group, 2011.
2. L. Buller and B. McNelis, “Effects of radiation on enhanced electronic cooling,” in 4th Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, pp. 130–135, 1988.
3. T. R. Harris, S. Melamed, S. Luniya, W. R. Davis, M. B. Steer, L. E. Doxsee, K. Obermiller, and C. Hawkinson, “Thermal analysis and verification of a mounted monolithic integrated circuit,” in Proceedings of the IEEE SoutheastCon, pp. 37–40, 2010.
4. V. Lakshminarayanan and M. Soundarakumar, “Thermal effects in a printed circuit board due to heat emission from mounted components,” in IMAPS Nordic Conference on Microelectronics Packaging (NordPac), pp. 101–108, 2017.
5. K. O. Petrosjanc, I. A. Kharitonov, N. I. Ryabov, and P. A. Kozynko, “Thermal design system for chip and board level electronic components,” in Proceedings of IEEE East-West Design & Test Symposium (EWDTS), pp. 247–250, 2009.
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