Preparation of polymer composites with electrostatic spinning promotes wound regeneration: A review

Author:

Yang Wanying12,Yang Cong3,Jing Guanghui1,Wang Sen12,Li Jing12,Zhang Xiaonan3,Liu Peng4,Yu Ning12ORCID

Affiliation:

1. Chongqing Institute of Green and Intelligent Technology, Chinese Academy of Sciences 1 , Chongqing 400714, China

2. University of Chinese Academy of Sciences 2 , Beijing 100049, China

3. Chongqing Municipal Key Laboratory of Oral Biomedical Engineering of Higher Education, Chongqing Key Laboratory of Oral Diseases and Biomedical Sciences, College of Stomatology, Chongqing Medical University 3 , Chongqing 401147, China

4. People’s Hospital Affiliated to Chongqing Three Gorges Medical College 4 , Chongqing 404120, China

Abstract

Wound dressings play a critical role in promoting healing by protecting wounds from external contaminants and providing an optimal environment for tissue regeneration. Traditional dressings, such as gauze and cotton, offer basic physical barriers but lack the ability to maintain a moist wound environment, which is essential for healing. Modern dressings, particularly those incorporating electrospun nanofibers, have emerged as advanced solutions that can sustain moisture, absorb exudate, and support cell growth and migration. This Review covers recent advances in electrospinning technologies and the design of composite materials that integrate natural and synthetic polymers, bioactive agents, and nanomaterials to enhance wound healing. In addition, it highlights key studies demonstrating the efficacy of these composites in various wound models. The primary objective of this Review is to inspire and guide future research endeavors, address existing limitations, and shed light on the promising research prospects in the field of wound healing and tissue regeneration.

Funder

Youth Innovation Promotion Association

Natural Science Foundation of Chongqing Municipality

Venture and Innovation Support Program for Chongqing Overseas Returnees

Publisher

AIP Publishing

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