Prediction of etch microtrenching using a neural network
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1789276
Reference16 articles.
1. High rate and highly selective SiO2 etching employing inductively coupled plasma and discussion on reaction kinetics
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3. Selective etching of SiO2 over polycrystalline silicon using CHF3 in an inductively coupled plasma reactor
4. Oxide via etching in a magnetically enhanced CHF3/CF4/Ar plasma
5. Modeling oxide etching in a magnetically enhanced reactive ion plasma using neural networks
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