Mechanical response of transient telechelic networks with many-part stickers-Reference-Cited by-同舟云学术

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Mechanical response of transient telechelic networks with many-part stickers

Published:2017-11-21 Issue:19 Volume:147 Page:194902
ISSN:0021-9606
Container-title:The Journal of Chemical Physics
language:en
Short-container-title:The Journal of Chemical Physics

Author:

Sing Michelle K.¹^ORCID,Ramírez Jorge²,Olsen Bradley D.³^ORCID

Affiliation:

1. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

2. Departamento de Ingeniería Química Industrial Y Medio Ambiente, Universidad Politécnica de Madrid, Madrid 28006, Spain

3. Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

Funder

DOD | United States Army | RDECOM | Army Research Office

Publisher

AIP Publishing

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://aip.scitation.org/doi/am-pdf/10.1063/1.4993649

Reference80 articles.

1. Tissue Cells Feel and Respond to the Stiffness of Their Substrate

2. Rational design of hydrogels for tissue engineering: Impact of physical factors on cell behavior

3. Ionically Cross-Linked Triblock Copolymer Hydrogels with High Strength

4. Composite Hydrogels for Scaffold Design, Tissue Engineering, and Prostheses

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced supramolecular design for direct ink writing of soft materials;Chemical Society Reviews;2023

2. Mechanistic Understanding of Sticker Aggregation in Supramolecular Polymers: Quantitative Insights from the Plateau Modulus of Triblock Copolymers;Macromolecules;2022-10-24

3. Mechanisms of Self-Diffusion of Linear Associative Polymers Studied by Brownian Dynamics Simulation;Macromolecules;2021-12-10

4. Sticker Multivalency in Metallo-supramolecular Polymer Networks;Macromolecules;2021-09-16

5. Effect of sticker clustering on the dynamics of associative networks;Soft Matter;2021

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