Grain boundary diffusivity of Ni in Au thin films and the associated degradation in electrical contact resistance due to surface oxide film formation
Author:
Funder
U.S. Department of Energy
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4795768
Reference31 articles.
1. Current and future uses of gold in electronics
2. Gold electrodeposition within the electronics industry
3. Electrochemically Deposited Diffusion Barriers
4. Development of a non-toxic electrolyte for soft gold electrodeposition: an overview of work at University of Newcastle upon Tyne
5. On the electrodeposition of hard gold
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Probing the effect of the electric current on the tribological performances of the electrical contact surfaces with graphene coating;Tribology International;2023-02
2. Electrodeposition of Pd–Ag alloy for electrical contacts;Surface Engineering;2022-06-03
3. Novel silver-enhanced hard gold electrodeposit applied for electrical contacts: comparison with conventional gold–cobalt alloy;Transactions of the IMF;2022-05-30
4. Improved contact resistance and solderability of electrodeposited Au-Sn alloy layer with high thermal stability for electronic contacts;Applied Surface Science;2021-06
5. Visualization of Kirkendall Voids at Cu-Au Interfaces by In Situ TEM Heating Studies;JOM;2019-08-28
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3