Determination of grain-boundary diffusion of Ag in nanocrystalline Cu by the Hwang–Balluffi method
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1346658
Reference30 articles.
1. Silver Grain Boundary Segregation in Copper
2. Diffusion processes in thin films
3. Grain boundary self-diffusion in Cu polycrystals of different purity
4. Reliability considerations for copper metallizations in ULSI circuits
5. Grain boundary activity measurements by auger electron spectroscopy
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