Cu sputtering and deposition by off-normal, near-threshold Cu+ bombardment: Molecular dynamics simulations
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.371040
Reference29 articles.
1. Copper deposition by electron cyclotron resonance plasma
2. Cu deposition using a permanent magnet electron cyclotron resonance microwave plasma source
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4. Cu Deposition Characteristics into Submicron Contact Holes Employing Self-Sputtering With a High Ionization Rate
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