The influence of Cu precipitation on electromigration failure in Al‐Cu‐Si
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.351655
Reference28 articles.
1. Electromigration in Thin Al Films
2. RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS
3. A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2
4. Morphology of electromigration-induced damage and failure in Al alloy thin film conductors
5. Reduction of Electromigration in Aluminum Films by Copper Doping
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