Simulated stress mitigation strategies in embedded bioprinting

Author:

Friedrich Leanne M.1ORCID,Gunther Ross T.2ORCID,Seppala Jonathan E.1ORCID

Affiliation:

1. National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, Maryland 20899, USA

2. Georgia Institute of Technology, North Ave. NW, Atlanta, Georgia 30332, USA

Abstract

Extrusion-based bioprinting is a powerful tool for fabricating complex cell-laden constructs. Embedded ink writing (EIW) is an extrusion-based printing technique wherein a nozzle embedded into a support bath writes continuous filaments. Because it allows for low-viscosity inks, EIW is particularly useful for bioprinting. One of the largest challenges in extrusion-based bioprinting is limiting the damage that cells experience inside the nozzle. Longer shear stress durations and higher shear stress magnitudes lead to more damage. Shape fidelity is also critical for bioprinting. Filaments in EIW can exhibit defects such as sharp edges and large aspect ratios, which can lead to porosity, surface roughness, and poor mechanical properties in the final part. We use numerical computational fluid dynamics simulations in OpenFOAM to evaluate whether common shear stress mitigation techniques improve cell viability without causing shape defects. Critically, we find that using a conical nozzle, increasing the nozzle diameter, decreasing the print speed, and decreasing the ink viscosity can improve the viability of stress magnitude-sensitive cells, but using a conical nozzle, increasing the nozzle length, and decreasing the print speed can increase damage in stress duration-sensitive cells. Additionally, using a conical nozzle or a larger nozzle can lead to larger shape defects in printed filaments. Material selection and printing parameter selection in embedded bioprinting should take into account allowable shape defects, allowable cell damage, and cell type.

Funder

U.S. Department of Commerce

Publisher

AIP Publishing

Subject

Condensed Matter Physics,Fluid Flow and Transfer Processes,Mechanics of Materials,Computational Mechanics,Mechanical Engineering

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