Microstructure of sputtered TiN on Al
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.119525
Reference10 articles.
1. Behavior of TiN and Ti Barrier Metals in Al‐Barrier‐Al Via Hole Metallization
2. Formation of a large grain sized TiN layer using TiNx, the epitaxial continuity at the Al/TiN interface, and its electromigration endurance in multilayered interconnection
3. Grain size and recrystallization of TiN, ZrN, NbN, and CrN alloyed and multilayer films
4. Deposition and properties of titanium nitride films produced by dc reactive magnetron sputtering
5. Structure of thin films of titanium nitride
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