Chip-embedded antenna-in-package module using modified polyimide (MPI) low-loss materials for millimeter-wave application

Abstract

In advanced millimeter-wave packaging technology, signal loss is considered the main problem, which can be resolved using low-loss circuits for minimizing transmission losses. Herein, the radio frequency integrated circuit (RF-IC), an active element, and the antenna are assembled in one package form to realize such a low-loss circuit by utilizing the modified polyimide (MPI) material. The material analysis of MPI reveals a dielectric constant of 2.5 with a loss of 0.0025 mm-waves (at 20 GHz) and confirms the curability of the proposed film at lower temperatures through differential scanning calorimetry analysis. Next, the antenna and the RF-IC were assembled in a single package using MPI to verify their suitability for the millimeter wave package. The 1 dB gain compression point (P1dB) of the integrated module is measured to be 31 dBm, with 20.38 dBm for a single RF-IC, confirming that the proposed MPI is a suitable candidate as a low-loss circuit for modern millimeter-wave packaging technology.