Nucleation and growth of voids in shock loaded copper bicrystals-Reference-Cited by-同舟云学术

Nucleation and growth of voids in shock loaded copper bicrystals

Published:2020 Issue: Volume: Page:
ISSN:0094-243X
Container-title:SHOCK COMPRESSION OF CONDENSED MATTER - 2019: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
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Author:

Fortin Elizabeth,Shaffer Benjamin,Opie Saul,Peralta Pedro

Publisher

AIP Publishing

Link

http://aip.scitation.org/doi/pdf/10.1063/12.0000905

Reference21 articles.

1. M. A. Meyers, Dynamic Behavior of Materials (John Wiley & Sons, New York, 1994), pp. 1–654.

2. A. Brown, “Three dimensional characterization of microstructural effects on spall damage in shocked polycrystalline copper,” Ph.D. thesis, Arizona State University, 2014.

3. Three-Dimensional Characterization of Incipiently Spalled Tantalum

4. Statistics of weak grain boundaries for spall damage in polycrystalline copper

5. Microstructural Effects on Damage Nucleation in Shock-Loaded Polycrystalline Copper

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