Experimental analysis of temperature and vapor core pressure for an annular heat pipe

Author:

Orea Daniel1ORCID,Anand N. K.1ORCID,Hassan Yassin A.2ORCID

Affiliation:

1. Department of Mechanical Engineering; Texas A&M University 1 , College Station, Texas 77840, USA

2. Department of Nuclear Engineering; Texas A&M University 2 , College Station, Texas 77840, USA

Abstract

The main contribution of this study is the effects of the operating conditions on the internal vapor pressure and temperature in an annular screen wick heat pipe, using distilled water as the working fluid. High-resolution pressure transducers, optical fiber distributed temperature sensors, and K-type thermocouples were employed to measure the internal and external temperatures as well as the local static pressures at different axial positions of the heat pipe. Temporal and frequency analysis using a one-dimensional continuous wavelet transform was performed on the differential pressure data to characterize flow behavior and infer the flow regime occurring within the heat pipe. The heat pipe was tested in multiple orientations with respect to the horizon (θ=0°, 45°, and 90°), heat loads (25, 50, and 75 W), and condenser coolant temperatures (Tw,in= 10 °C, 20 °C, and 30 °C). To estimate the vapor-phase flow friction factor for multiple Reynolds numbers, the Lockhart–Martinelli correlation was employed. This study provides critical experimental data and analyses for complex two-phase flow behavior in an annular wick heat pipe geometry. The thermal resistance and effective thermal conductivity were estimated as a function of the heat pipe orientation and power input. The experimental investigation revealed that power input and orientation influence both the internal vapor core and external surface temperatures, as well as the local pressure response. The outcomes from this study provide a valuable database that supports the advancement of heat pipe design, modeling, and validation.

Funder

U.S. Nuclear Regulatory Commission

Publisher

AIP Publishing

Subject

Condensed Matter Physics,Fluid Flow and Transfer Processes,Mechanics of Materials,Computational Mechanics,Mechanical Engineering

Reference97 articles.

1. R. S. Gaugler , “ Heat transfer device,” U.S. Patent 2,350,348 (6 June 1944).

2. Structures of very high thermal conductance;J. Appl. Phys.,1964

3. Heat pipe for aerospace applications—An overview;J. Electron. Cooling Therm. Control,2015

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