Electromigration‐induced void growth in bamboo structures
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.354413
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1. Electromigration in metals
2. Statistical Metallurgical Model for Electromigration Failure in Aluminum Thin‐Film Conductors
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5. Current-induced marker motion in gold wires
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5. Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines;Advances in Electronic Packaging, Parts A, B, and C;2005-01-01
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