Au–Sn solder bumps with tungsten silicide based barrier metallization schemes
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.114347
Reference14 articles.
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders;Materials Science and Engineering: A;2019-09
2. Microstructural evolution of the Au–20wt.% Sn solder on the Cu substrate during reflow;Journal of Alloys and Compounds;2009-10
3. Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow;Scripta Materialia;2008-04
4. Microstructure of eutectic 80Au/20Sn solder joint in laser diode package;Microelectronic Engineering;2008-03
5. Flip-chip bump-lead fabrication: A review;Russian Microelectronics;2008-03
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