Forced flow atomic layer deposition of TiO2 on vertically aligned Si wafer and polysulfone fiber: Design and efficacy of conduit plates and soak function-Reference-Cited by-同舟云学术

Forced flow atomic layer deposition of TiO2 on vertically aligned Si wafer and polysulfone fiber: Design and efficacy of conduit plates and soak function

Published:2018-10 Issue:10 Volume:89 Page:105108
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Mishra Mrinalini¹^ORCID,Chan Chia-Yen²,Kei Chi-Chung²,Yen Yin-Cheng¹,Liao Ming-Wei¹,Perng Tsong-Pyng¹^ORCID

Affiliation:

1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 300, Taiwan

2. Instrument Technology Research Center, National Applied Research Laboratories, Hsinchu 300, Taiwan

Funder

Ministry of Science and Technology, Taiwan

Publisher

AIP Publishing

Subject

Instrumentation

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5043476

Reference38 articles.

1. Surface modification of plasma-pretreated poly(tetrafluoroethylene) films by graft copolymerization

2. Inorganic coatings on polymers

3. Plasma-modified interfaces between polypropylene films and vacuum roll-to-roll coated thin barrier layers

4. Antibacterial textiles prepared by RF-plasma and vacuum-UV mediated deposition of silver

5. Atomic Layer Deposition on Electrospun Polymer Fibers as a Direct Route to Al2O3 Microtubes with Precise Wall Thickness Control

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