Reaction between Cu and PtSi with Cr, Ti, W, and C barrier layers
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.345183
Reference19 articles.
1. Thermal stability of the Cu/PtSi metallurgy
2. Electrical and mechanical features of the platinum silicide‐aluminum reaction
3. Formation of PtSi in the presence of Al
4. Barrier layers: Principles and applications in microelectronics
5. Diffusion barriers in layered contact structures
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