Morphological evolution of tilted grain-boundary thermal grooving by surface diffusion in bicrystal thin solid films having strong anisotropic surface Gibbs free energies
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2952520
Reference36 articles.
1. Three-dimensional simulations of self-assembly of hut-shaped Si–Ge quantum dots
2. Mesoscopic nonequilibrium thermodynamics of solid surfaces and interfaces with triple junction singularities under the capillary and electromigration forces in anisotropic three-dimensional space
3. Variational formulation of irreversible thermodynamics of surfaces and interfaces with grain-boundary triple-junction singularities under the capillary and electromigration forces in anisotropic two-dimensional space
4. Symmetry breaking in self-assembled monolayers on solid surfaces: Anisotropic surface stress
5. Grain boundary grooving at the singular surfaces
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1. A predictive model for microstructure evolution in metallic multilayers with immiscible constituents;Acta Materialia;2012-11
2. Mesoscopic nonequilibrium thermodynamics treatment of the grain boundary thermal grooving induced by the anisotropic surface drift diffusion;Journal of Materials Science;2011-09
3. Morphological evolution in a strained-heteroepitaxial solid droplet on a rigid substrate: Dynamical simulations;Journal of Applied Physics;2010-09-15
4. Thermal grain-boundary grooving in bicrystal thin solid films having strong anisotropic surface Gibbs free energy represented by the modified cycloid-curtate function;Journal of Crystal Growth;2009-03
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