Inter-wafer bonding strength characterization by laser-induced shock waves
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4710987
Reference24 articles.
1. Wafer bonding for silicon‐on‐insulator technologies
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4. Measurement of interface strength by a laser spallation technique
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