Methodology and meaning of computing heat flux via atomic stress in systems with constraint dynamics
Author:
Affiliation:
1. Institute of Fluid Science, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan
Funder
Core Research for Evolutional Science and Technology
Japan Society for the Promotion of Science
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0070930
Reference36 articles.
1. REVIEW
2. Fast Parallel Algorithms for Short-Range Molecular Dynamics
3. General formulation of pressure and stress tensor for arbitrary many-body interaction potentials under periodic boundary conditions
4. Force and heat current formulas for many-body potentials in molecular dynamics simulations with applications to thermal conductivity calculations
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Research on molecular dynamics of heat and mass transfer of liquids on surfaces with different shapes of nanoscale pore structures;International Journal of Heat and Fluid Flow;2024-12
2. Multi-scale modeling of thermal and chemical kinetic characterization of composites during high-temperature pyrolysis by scale-bridging reactive molecular dynamics;International Journal of Heat and Mass Transfer;2024-10
3. Impact of adsorption on thermal conductivity dynamics of adsorbate and adsorbent: Molecular dynamics study of methane and Cu-BTC;iScience;2024-08
4. Development of embedded-atom method (EAM) potential for Palladium–Barium alloy;Molecular Simulation;2024-07-16
5. Reversible two-way tuning of thermal conductivity in an end-linked star-shaped thermoset;Nature Communications;2024-07-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3