Silicon and silicon dioxide thermal bonding for silicon‐on‐insulator applications
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.340976
Reference6 articles.
1. Silicon‐to‐silicon direct bonding method
2. Wafer bonding for silicon‐on‐insulator technologies
3. Penetration Depth of the Scanning Acoustic Microscope
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