Semidry release of nanomembranes for tubular origami

Author:

Guo Qinglei12ORCID,Wei Zhihuan1,Xue Zhongying3,Jiang Chengming4ORCID,Zhao Haonan1,Zhang Yifei1ORCID,Wang Gang5,Chen Da5,Di Zengfeng3ORCID,Mei Yongfeng26

Affiliation:

1. Center of Nanoelectronics, School of Microelectronics, Shandong University, Jinan 250100, People's Republic of China

2. State Key Laboratory of ASIC and Systems, Fudan University, Shanghai 200433, People's Republic of China

3. State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, People's Republic of China

4. Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education, Dalian University of Technology, Dalian 116024, People's Republic of China

5. Department of Microelectronic Science and Engineering, Faculty of Science, Ningbo University, Ningbo 315211, People's Republic of China

6. Department of Materials Science, Fudan University, Shanghai 200433, People's Republic of China

Funder

Qilu Young Scholar Program of Shandong University

State Key Laboratory of ASIC & System

Shandong University Multidisciplinary Research and Innovation Team of Young Scholars

National Natural Science Foundation of China

Science and Technology Commission of Shanghai Municipality

The Program of Shanghai Academic Research Leader

Key Research and Development Program of Shandong Province

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Anisotropic frictional properties between Ti3C2Tx MXene/SiO2 layer-dependent heterojunctions;Journal of Science: Advanced Materials and Devices;2021-09

2. Recent mechanical processing techniques of two-dimensional layered materials: A review;Journal of Science: Advanced Materials and Devices;2021-06

3. Development and current situation of flexible and transparent EM shielding materials;Journal of Materials Science: Materials in Electronics;2021-02-13

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