Reliability of indium-tin-zinc-oxide thin-film transistors under dynamic drain voltage stress

Author:

Zhu Guanming12ORCID,Chen Zhiying2ORCID,Zhang Meng12ORCID,Lu Lei3ORCID,Deng Sunbin4ORCID,Wong Man4ORCID,Kwok Hoi-Sing4ORCID

Affiliation:

1. Key Laboratory of Radio Frequency Heterogeneous Integration, Shenzhen University 1 , Shenzhen 518060, China

2. College of Electronics and Information Engineering, Shenzhen University 2 , Shenzhen 518060, China

3. School of Electronic and Computer Engineering, Shenzhen Graduate School, Peking University 3 , Shenzhen 518055, China

4. State Key Laboratory of Advanced Displays and Optoelectronics Technologies, The Hong Kong University of Science and Technology 4 , Hong Kong, China

Abstract

In this Letter, the reliability of indium-tin-zinc-oxide thin-film transistors (TFTs) under dynamic drain voltage stress is investigated. A degradation phenomenon, associated with both pulse rising time (tr) and falling time, is observed. Through the technology computer-aided design simulation and recovery experiment, it is discovered that the tr-dependent dynamic hot carrier effect and integral voltage-dependent electron detrapping jointly affect the device's reliability. Finally, an AC degradation model in indium-tin-zinc oxide TFTs, considering the non-equilibrium junction, hot carrier injection, and recovery, was proposed.

Funder

Shenzhen Municipal Research Program

National Natural Science Foundation of China

Innovation and Technology Fund of Hong Kong

National Taipei University of Technology - Shenzhen Universtiy Joint Research Program

Independent Scientific Research Program from State Key Laboratory of Radio Frequency Heterogeneous Integration

Publisher

AIP Publishing

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