Impact of reductive N2∕H2 plasma on porous low-dielectric constant SiCOH thin films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1926392
Reference19 articles.
1. Particle-Packing Phenomena and Their Application in Materials Processing
2. Low dielectric constant materials for microelectronics
3. Low dielectric constant films prepared by plasma-enhanced chemical vapor deposition from tetramethylsilane
4. Permittivity and Conductivity of Low-Dielectric-Constant SiOC:H Films Deposited by Plasma-Enhanced Chemical Vapor Deposition
5. Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-kto extreme low-kinterconnect materials
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