Enhanced heat transfer through filler-polymer interface by surface-coupling agent in heat-dissipation material: A non-equilibrium molecular dynamics study
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4831946
Reference36 articles.
1. Investigation of thermal management materials for automotive electronic control units
2. Advanced Materials for Thermal Management of Electronic Packaging
3. The Changing Automotive Environment: High-Temperature Electronics
4. Thermal conductivity of polymers filled with particulate solids
5. Enhanced thermal conductivity of polymer composites filled with three-dimensional brushlike AlN nanowhiskers
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