Dispersive readout of a high-Q encapsulated micromechanical resonator

Abstract

Encapsulated bulk mode microresonators in the megahertz range are used in commercial timekeeping and sensing applications, but their performance is limited by the current state of the art of readout methods. We demonstrate a readout using dispersive coupling between a high-Q encapsulated bulk mode micromechanical resonator and a lumped element microwave resonator that is implemented with commercially available components and standard printed circuit board fabrication methods and operates at room temperature and pressure. A frequency domain measurement of the microwave readout system yields a displacement resolution of [Formula: see text], which demonstrates an improvement over the state of the art of displacement measurement in bulk-mode encapsulated microresonators. This approach can readily be implemented in cryogenic measurements, allowing for future work characterizing the thermomechanical noise of encapsulated bulk mode resonators at cryogenic temperatures.