Stress reduction in tungsten films using nanostructured compliant layers
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1803106
Reference27 articles.
1. Electromigration reliability of dual-damascene Cu/porous methylsilsesquioxane low k interconnects
2. Stress and Stability of Sputter Deposited A-15 and BCC Crystal Structure Tungsten Thin Films
3. Self-organized structuring of W/C multilayers on Si substrate
4. Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W
5. Residual stresses in the failure of W–Pt–Ag metallizations on oxidized Si
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