Calculation of effective dielectric constants for advanced interconnect structures with low-k dielectrics
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1614438
Reference3 articles.
1. Process Integration and Manufacturasility Issues for High Performance Multilevel Interconnect
2. Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric
3. Characteristics of fluorinated amorphous carbon films and implementation of 0.15 μm Cu/a-C:F damascene interconnection
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