A novel sacrificial-layer process based on anodic bonding and its application in an accelerometer
Author:
Affiliation:
1. Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, China P.C.: 361005
Funder
China Aviation Produce-Learn-Research projects
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://scitation.aip.org/deliver/fulltext/aip/journal/adva/5/4/1.4907930.pdf?itemId=/content/aip/journal/adva/5/4/10.1063/1.4907930&mimeType=pdf&containerItemId=content/aip/journal/adva
Reference9 articles.
1. Deep silicon etch for biology MEMS fabrication: review of process parameters influence versus chip design
2. Investigation of silicon/glass anodic bonding with PECVD silicon carbide as the intermediate layer
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1. Electro-thermal poling in bioactive sodium‑calcium phosphate-silicate glass: Anodic near-surface network connectivity changes and second harmonic generation;Journal of Non-Crystalline Solids: X;2023-03
2. A novel combined anodic-adhesive bonding technique for joining glass to metal for micro device applications;International Journal of Adhesion and Adhesives;2022-09
3. Construction of a spherically bent crystal analyzer through anodic bonding for a non-resonant inelastic X-ray scattering spectrometer;Instrumentation Science & Technology;2021-04-14
4. Design, Fabrication and Test of a Low Range Capacitive Accelerometer With Anti-Overload Characteristics;IEEE Access;2020
5. MEMS pressure sensor based on optical Fabry–Perot interference;Optik;2018-07
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