Low target power wafer sputtering regime identified during magnetron tantalum barrier physical vapor deposition
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1980532
Reference8 articles.
1. Deposition of copper by using self-sputtering
2. Magnetron plasma structure with strong magnetic field
3. Comparing ionized physical vapor deposition and high power magnetron copper seed deposition
4. Plasma and process characterization of high power magnetron physical vapor deposition with integrated plasma equipment—feature profile model
5. Modeling high power magnetron copper seed deposition: Effect of feature geometry on coverage
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1. Laser generation of surface acoustic modes guided by copper lines of sub-micron width on silicon;Ultrasonics;2010-06
2. Recent Progress in Researches on Sputter Deposition Process;SHINKU;2007
3. Modeling HfO[sub 2] atomic layer chemical vapor deposition on blanket wafer, via, and trench structures using HfCl[sub 4]∕H[sub 2]O;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2006
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