Author:
Mesquita Laila Veríssimo,Klasen Nils,Fokuhl Esther,Philipp Daniel,Bauermann Luciana Pitta
Reference9 articles.
1. Acoustic microscopy-a summary
2. Non-destructive wafer-level bond defect identification by scanning acoustic microscopy
3. P. Baliozian, E. Lohmüller, T. Fellmeth, N. Wöhrle, A. Krieg, and R. Preu, Sol. RRL 1700171, 1–5 (2018).
4. A. Mondon, N. Klasen, E. Fokuhl, M. Mittag, M. Heinrich, and H. Wirth, “Comparison of layouts for shingled bifacial PV modules in terms of power output, cell-to-module ratio and bifaciality”. Proceedings of the 35th European PV Solar Energy Conference and Exhibition, (2018).
5. N. Klasen, A. Mondon, A. Kraft and U. Eitner, “Shingled Cell Interconnection: A New Generation of Bifacial PV-Modules”, 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells (2017).
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