Collapse of stamps for soft lithography due to interfacial adhesion
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1900303
Reference10 articles.
1. Unconventional Methods for Fabricating and Patterning Nanostructures
2. Three-Dimensional and Multilayer Nanostructures Formed by Nanotransfer Printing
3. Elastomeric Transistor Stamps: Reversible Probing of Charge Transport in Organic Crystals
4. Soft, conformable electrical contacts for organic semiconductors: High-resolution plastic circuits by lamination
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