The effect of substrate temperature on the critical velocity in microparticle impact bonding-Reference-Cited by-同舟云学术

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The effect of substrate temperature on the critical velocity in microparticle impact bonding

Published:2021-07-05 Issue:1 Volume:119 Page:011903
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Chaban Ievgeniia¹²^ORCID,Sun Yuchen¹²³^ORCID,Veysset David²^ORCID,Nelson Keith A.³^ORCID,Schuh Christopher A.¹^ORCID

Affiliation:

1. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

2. Institute for Soldier Nanotechnologies, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

3. Department of Chemistry, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

Funder

U.S. Department of Energy

Office of Naval Research

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

https://aip.scitation.org/doi/am-pdf/10.1063/5.0055274

Reference40 articles.

1. Metal deposition from a supported metal film using an excimer laser

2. The Cold Spray Process and Its Potential for Industrial Applications

3. In-situ observations of single micro-particle impact bonding

4. Particle size effects in metallic microparticle impact-bonding

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1. Towards a quantitative understanding of bonding in supersonic single particle impacts: A three-dimensional FIB-SEM exploration;Acta Materialia;2024-09

2. Heterogeneous microstructural evolution during hydrodynamic penetration of a high-velocity copper microparticle impacting copper;Materials Today;2023-12

3. Improving inter-particle deformation and bonding by preserving transient in-situ deposition temperatures during cold spray;Surface and Coatings Technology;2023-12

4. Modeling Parameters for Finite Element Simulation of Residual Stress in Cold Spray and the Stress Evolution and Distribution;Journal of Thermal Spray Technology;2023-08-09

5. 激光驱动的微弹道冲击;SCIENTIA SINICA Physica, Mechanica & Astronomica;2023-08-01

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