Metal-oxide buffer layer for maintaining topological bumpy surface underlayer of columnar CoPt-SiO2 granular media deposited at high substrate temperature
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4918566
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5. High $K_{{{u}}}$ and Low Intergranular Exchange Coupling of Postannealed CoPt-WO3 Granular Film
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1. Ru Underlayer Elimination for CoPt-Based Sputtered Tape With Perpendicular Recording Toward 330 TB per Cartridge Product;IEEE Transactions on Magnetics;2021-02
2. Ru Alloy-Oxide Buffer Layer for Intergranular Exchange Decoupling of CoPt–B2O3 Granular Media;IEEE Transactions on Magnetics;2018-02
3. Understanding the Nanostructure Formation of the Templated Two-Phase Film Growth via Hybrid Modeling;Crystal Growth & Design;2017-01-31
4. Effect of Topological Bumpy Surface Underlayer on Compositionally Modulated Atomic Layer Stacking in High ${K}_{u}$ hcp Co80Pt20 Film With (00.2) Crystallographic Texture Orientation;IEEE Transactions on Magnetics;2015-11
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