Author:
Nasirabadi P. Shojaee,Jabbari M.,Hattel J. H.
Reference8 articles.
1. Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications
2. J. B. Jacobsen, J. P. Krog, L. Rimestad, A. Riis, and A. H. Holm, “Climatic challenges and product level solutions for electronics in demanding applications,” in IMAPS Nordic, 2012.
3. Modeling of structural mechanics, moisture diffusion, and heat conduction coupled with physical aging in thin plastic plates
4. Water Vapor Permeation Resistance of Polycarbonate at Various Temperatures
5. Food Structure and Moisture Transfer, Springer, 2013.
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