Author:
Karepova E.,Derevyanko V.,Nesterov D.,Shan’ko Yu.
Reference13 articles.
1. D. S. Steinberg, Vibration Analysis for Electronic Equipment (A Wiley-Interscience publication, New York, 2000) 432p.
2. Recent trend in condition monitoring for equipment fault diagnosis
3. A review on the application of deep learning in system health management
4. Z. Duan, T. Wu, S. Guo, T. Shao, R. Malekian, and Z. Li (2018) The Int. J. of Adv. Manuf. Technol. 96, 803–819.
5. M. Ruusunen, M. Paavola, M. Pirttimaa, and K. Leiviska, “Comparison of three change detection algorithms for an electronics manufacturing process,” in Proceedings 2005 IEEE International Symposium on Computational Intelligence in Robotics and Automation, edited by H. Koivo (IEEE Operations Center, Piscataway, USA, 2005), pp. 679–683.
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