Real-time dielectric-film thickness measurement system for plasma processing chamber wall monitoring
Author:
Affiliation:
1. Department of Electrical Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, South Korea
Funder
Converging Research Center Program
National R&D Program
Technology Innovation Program
Publisher
AIP Publishing
Subject
Instrumentation
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4936770
Reference11 articles.
1. Principles of Plasma Discharges and Materials Processing
2. Real-time observation of the capacitance variation in a surface dielectric layer in radio frequency discharge
3. Particle‐plasma interactions in low‐pressure discharges
4. Relation between the ion flux, gas phase composition, and wall conditions in chlorine plasma etching of silicon
5. New diagnostic method for monitoring plasma reactor walls: Multiple total internal reflection Fourier transform infrared surface probe
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2. A method for measuring plasma parameters and dielectric film thickness by analyzing transient voltages for deposition plasma processing monitoring;Plasma Sources Science and Technology;2020-07-22
3. Noninvasive electrical plasma monitoring method using reactor substrates as alternative current-sensing electrodes;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2018-05
4. Development of the Virtual Metrology for the Nitride Thickness in Multi-Layer Plasma-Enhanced Chemical Vapor Deposition Using Plasma-Information Variables;IEEE Transactions on Semiconductor Manufacturing;2018-05
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