New method to improve the adhesion strength of tungsten thin film on silicon by W2N glue layer
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.107880
Reference16 articles.
1. Properties and microelectronic applications of thin films of refractory metal nitrides
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3. Nitrogen, oxygen, and argon incorporation during reactive sputter deposition of titanium nitride
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