The role of gallium nitride in the evolution of electric vehicles: Energy applications, technology, and challenges

Abstract

It is only recently that the electric vehicle (EV) has evolved into a contemporary invention. There has been a rapid acceleration in the development of EVs in a number of nations in order to lessen their reliance on oil and their contribution to environmental pollution. In the tangible world, fully EVs do not release any carbon dioxide (CO2) emissions from their tailpipes, unlike any other conventional vehicles. This results in a 50%–70% CO2 reduction in air pollution per year. The achievement of electrification in transportation has led to a reduction in the weight and size of the vehicles as the need for internal combustion engines can be eliminated. Wide bandgap materials such as silicon carbide (SiC) and gallium nitride (GaN) offer advantages in the manufacturing of EVs. Beginning the late 2000s, the EV industry has begun to adopt GaN devices in their manufacturing processes. The semiconductor material GaN stands out as a material for power electronic systems in EVs owing to its high switching frequency, higher temperature limit, and high voltage breakdown. This review aims to provide a comprehensive overview of semiconductor GaN materials for EV applications, which could be useful to provide insights for researchers and scientists to accelerate their innovation for the improvement of EVs. This review begins with an introduction to EVs, followed by the anticipated demand for EVs. The application of GaN devices in EVs, compared to the traditional Si and SiC devices, which are the primary power devices in current EVs, is discussed. The recent advancement in GaN devices that are capable of being used in various components of a fully automated EV, such as the battery, energy storage system, auxiliary power unit, and motor drive, in addition to their use in different non-automotive vehicles such as electric aircraft, electric ships, electric railways, electric submarines, and heavy duty vehicles, is also discussed. Finally, the challenges posed by GaN devices and potential solutions to overcome these shortcomings have been addressed.